Modeling and Optimization of Advanced Multilayered Absorbers
Abstract—In this contribution we present a design environment
for the optimization of layered absorbers. The manufacturer
has a wide set of materials with known properties available.
The thickness of these materials can vary within given limits. For
a given number of layers and given absorption requirements as
a function of angle of incidence, polarization and frequency we
try to optimize for the thicknesses of the layers and for the
best possible choice of available material types. The optimization
for the layer thicknesses is done using a simulated annealing
technique and for selecting materials usually the whole discrete
design space is sampled. The paper is illustrated with two
realizations comprising comparisons between simulations and
measurements.
采購指南
更多>>特別推薦
- 噪聲中提取真值!瑞盟科技推出MSA2240電流檢測芯片賦能多元高端測量場景
- 10MHz高頻運行!氮矽科技發布集成驅動GaN芯片,助力電源能效再攀新高
- 失真度僅0.002%!力芯微推出超低內阻、超低失真4PST模擬開關
- 一“芯”雙電!圣邦微電子發布雙輸出電源芯片,簡化AFE與音頻設計
- 一機適配萬端:金升陽推出1200W可編程電源,賦能高端裝備制造
技術文章更多>>
- 高通加速多元化布局,全面發布數據中心戰略,預計未來三到五年迎來多個關鍵拐點
- Lenovo入選2026年Gartner?全球供應鏈25強
- 綠色AI向前一步,英特爾聯合英維克、嘉實多發布單相冷板液冷工質測試驗證成果
- 以“In Everything, Better”賦能AI生態,TDK將攜最新方案亮相2026慕尼黑上海電子展
- 羅德與施瓦茨與中國移動研究院聯合展示面向生成式AI應用體驗測試解決方案
技術白皮書下載更多>>
- 車規與基于V2X的車輛協同主動避撞技術展望
- 數字隔離助力新能源汽車安全隔離的新挑戰
- 汽車模塊拋負載的解決方案
- 車用連接器的安全創新應用
- Melexis Actuators Business Unit
- Position / Current Sensors - Triaxis Hall
熱門搜索
Aptina
ARM
Arrow
ASIC
ATA連接器
Atmel
Audience
Avnet
BOM
Broadcom
BTG可控硅
CCD
CEVA
Cirrus Logic
CNR
CPU
CPU使用率高
Cree
DC/AC電源模塊
dc/dc
DC/DC電源模塊
DDR2
DDR3
DIY
DRAM
DSP
DSP
D-SUB連接器
DVI連接器
EEPROM


